Wafer-level packaging - Wikipedia
WEBWafer-level chip scale packaging (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies, such as Advanced Semiconductor Engineering (ASE). [4]
Chip-scale package - Wikipedia
WEBA chip scale package or chip-scale package (CSP) is a type of integrated circuit package. [1] Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging.
WEBPurpose. This document provides guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB) assembly necessary to achieve high yield and reliability.
Understanding Flip-Chip and Chip-Scale Package Technologies ... - Analog
WEBApr 18, 2007 · CSP devices are manufactured in a process called wafer-level packaging (WLP). The major benefit of WLP is that all package fabrication and testing is done on wafer. The cost of WLP drops as the wafer size increases and as the die shrinks.
WEBWafer level packaging is where a die is packaged while still in wafer form, either singly or combined with additional dies or other components such as discrete passive devices, or functional components like micro-electromechanical systems (MEMS) or …
Wafer level chip scale packaging (WL-CSP): an overview
WEBSeveral wafer level chip scale package (WLCSP) technologies have been developed which generate fully packaged and tested chips on the wafer prior to dicing. Many of these technologies are based on simple peripheral pad redistribution technology followed by attachment of 0.3-0.5 mm solder balls.
WEBThis application note provides an overview of Broadcom's WLCSP (Wafer-Level Chip Scale Package) technology and includes design and manufacturing guidelines for high yield and high reliability assembly.
WEBThe wafer level chip scale package (WLCSP) is a variant of the flip-chip interconnection technique where all packaging is done at the wafer level. With WLCSPs, the active side of the die is inverted and connected to the printed circuit board (PCB) using solder balls.
WEBChapter 15. Wafer Level Chip Scale Packaging. Michael T€opper. Abstract Wafer level chip scale packaging (WL-CSP) based on redistribution is the key technology which is evolving to system in package (SiP) and heterogeneous integration (HI) extended by 3-D packaging using through silicon vias (TSV).
WLCSP Wafer Level CSP Wafer Level Packaging - Amkor ... - Amkor Technology
WEBAmkor Technology offers Wafer Level Chip Scale Packaging (WLCSP) providing a solder interconnection directly between a device and the motherboard of the end product.
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