AST's 95,000-square-meter plant will produce large-body, high-layer-count substrates for AI computing and networking chips.

FC-BGA substrate maker Samsung Electro-Mechanics (SEMCO) approved a record $4.99 billion investment to expand AI chip packaging capacity at its Sejong, South Korea plant and Vietnamese subsidiary -- ...

Compared to through-hole construction, inspecting SMD construction is a whole other game. Things you thought were small before are almost invisible now, and making sure solder got where it’s supposed ...

SEOUL, South Korea, May 12, 2025 /PRNewswire/ -- LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the ...

LG Innotek CEO Moon Hyuk-soo said the company's flip-chip ball grid array (FC-BGA) business will begin to improve next year, ...

Ibiden’s flip chip BGA substrate hides under every shiny flagship processor, yet decides heat, speed, and even power draw. What looks like a flat green plate is in fact a tightly engineered backbone ...

It was almost a year ago when we first heard details about AMD's plans for its top-dog mobile part for Zen 5, which goes by the name Strix Halo. For Zen 5 in laptops, AMD is developing two lines of ...

Greenliant has recently announced the release of its NVMe NANDrive BGA SSDs, a new line of solid-state drives designed to endure the harshest environments while delivering exceptional performance.

The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, ...