Samsung Electro-Mechanics and NVIDIA signed a co-investment deal Wednesday establishing NVIDIA-exclusive FC-BGA substrate ...

FC-BGA substrate maker Samsung Electro-Mechanics (SEMCO) approved a record $4.99 billion investment to expand AI chip packaging capacity at its Sejong, South Korea plant and Vietnamese subsidiary -- ...

A surge in AI demand has pushed the broader electronics components industry into a boom cycle that rivals the memory chip ...

Page Report Shows Test & Burn-in Sockets Reaching $575.8 Million by 2032 and China Climbing to $313.5 Million as IoT Devices, Consumer Electronics and Higher Pin-Count Designs Drive DemandDublin, Oct.

LG Innotek CEO Moon Hyuk-soo said the company's flip-chip ball grid array (FC-BGA) business will begin to improve next year, ...

AST's 95,000-square-meter plant will produce large-body, high-layer-count substrates for AI computing and networking chips.

Intel ($INTC), and Advanced Micro Devices ($AMD) are falling in premarket trading on Thursday. Seoul’s Maeil Business Newspaper ...

Three leading global semiconductor giants have officially secured critical production capacity, marking a pivotal strategic ...

The Intel Core Ultra 5 235H is a mobile processor with 14 cores, launched in January 2025. It is part of the Ultra 5 lineup, ...

The 95,000-square-metre facility near Jurong Lake District will start producing large-body, high-layer-count substrates for ...

Samsung Electro-Mechanics and Nvidia will jointly expand AI chip substrate production in South Korea under a long-term supply ...

Samsung Electro-Mechanics plans to invest about $5 billion in expanding chip package substrate production in South Korea and Vietnam by 2028.