The new portfolio combines transient fault detection, high-voltage power protection and precision clocking for AI ...
The reference design combines 650V GaN FETs, a 200 MHz digital controller and hardware security for high-density rack power conversion. The reference design uses Microchip’s dsPIC33AK digital signal ...
The platform standardizes grid interaction, system integration, installation, and maintenance in large-scale electrolysis ...
The facility will combine diamond synthesis, surface preparation, metrology and process integration for semiconductor ...
In this Power Corner interview, Thomas Rodgers, Head of Business Sector Electronics of Zeiss Microscopy, discusses failure ...
IEEE LI’s free Power Electronics Symposium returns Nov. 5 in Hauppauge, NY, with technical talks, an exhibit floor, and networking meals. Long Island’s power electronics community will gather on ...
The dual SiC MOSFET module combines an 800 A drain-current rating with a 300 kA²s diode I²t rating for demanding power ...
The axial-leaded devices combine 6, 8 and 10 kA surge ratings with stable clamping and MIL-STD-750 screening for demanding ...
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