证券之星股票频道 on MSN
【投融资动态】科阳半导体股权转让融资，交易额为2亿人民币
证券之星消息，根据天眼查APP于10月13日公布的信息整理，苏州科阳半导体有限公司股权转让融资，交易额2亿人民币。
Maximize ROI by prioritizing serial, Octal/xSPI and high-density NOR for automotive and industrial uses, while outsourcing advanced-node production to curb capital costs.Dublin, Oct. 12, 2026 (GLOBE ...
GigaDevice (HKEX: 3986), a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), ...
경북 구미시가 반도체 후공정 전문기업 LB세미콘㈜의 전력반도체 제조라인 증설 투자를 유치하며 반도체 산업 생태계 확장에 박차를 가한다. 구미시는 30일 LB세미콘 대표이사와 김장호 구미시장, 이남억 경북도 공항투자본부장 등이 참석한 가운데 LB세미콘(주)과 전력반도체 후공정 생산라인 증설을 위한 투자양해각서(MOU)를 체결했다. 투자는 웨이퍼에 얇은 유리막 ...
ルネサス エレクトロニクスが、アナログ／デジタル混載コンフィギュラブルIC「GreenPAK」新製品のサンプル出荷を開始した。1.155mm角と小型ながら、何度でも設定を書き換えられるマルチタイムプログラマブル（MTP）機能を搭載。量産開始は2026年11月を予定している。
Renesas Electronics Corporation hat den SLG46801 vorgestellt, das kleinste konfigurierbare Mixed-Signal-Bauelement der GreenPAK-Familie, das sowohl im WLCSP- als auch im STQFN-Gehäuse ...
The industry's smallest WLCSP-packaged GreenPAK device, featuring a 9-ball, 1.155 mm × 1.155 mm, with an STQFN option for additional I/O and package flexibility. Multi-time programmable and target I²C ...
Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale ...
本文聚焦32位MCU在WLCSP、QFN与0.4mm pitch BGA等小型封装中的工程权衡，分析其面积、热阻、PCB布线、SMT良率及可靠性差异。重点对比WLCSP的极致小型化优势与脆性、散热与焊接挑战，指出QFN在成本与 ...
受价格及国产替代加速等多要素驱动，功率半导体一直都是市场炒作的热门赛道，而功率半导体器件供应商，中国内地最大的WLCSP MOSFET产品供应商，威兆半导体两次递表冲刺港交所。 智通财经APP ...
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