After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, ...

Typical reticle usage Chip manufacturing costs are heavily dependent on throughput in the fab, which typically is measured by the number of wafers that can be processed per hour. Assuming yield is ...

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line macro defect inspection and guardbanding are important and powerful tools that ...

Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.

Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to ...

Diversity of compute elements proliferates for inference, but the mix varies by application. With AI changing so fast, it’s a ...