The new portfolio combines transient fault detection, high-voltage power protection and precision clocking for AI ...
The platform standardizes grid interaction, system integration, installation, and maintenance in large-scale electrolysis ...
The dual SiC MOSFET module combines an 800 A drain-current rating with a 300 kA²s diode I²t rating for demanding power ...
The axial-leaded devices combine 6, 8 and 10 kA surge ratings with stable clamping and MIL-STD-750 screening for demanding ...
In this Power Corner interview, Thomas Rodgers, Head of Business Sector Electronics of Zeiss Microscopy, discusses failure ...
The facility will combine diamond synthesis, surface preparation, metrology and process integration for semiconductor ...
The reference design combines 650V GaN FETs, a 200 MHz digital controller and hardware security for high-density rack power conversion. The reference design uses Microchip’s dsPIC33AK digital signal ...
Wafer-scale single-crystal diamond and direct bonding move diamond from research toward thermal management for power electronics. Each new generation of AI accelerator pushes more current through a ...
The driver uses 15 A three-phase variable-current control to reduce switching losses and support configurable SiC and IGBT designs. Skyworks Solutions has completed AEC-Q100 automotive qualification ...
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